The herewith scholarship is provided for pursuing PhD/ Research degree level in Software Engineering for Embedded and Cyber Physical Systems by the University of Duisburg-Essen and can be taken at Germany.
Keeping in view the far-reaching enlargement of variants and complexity in systems and systems of systems, which supply huge potential for innovation and adds value whilst sticking on to strict safety requirements, bearing new and highly demanding challenges for the software engineering of Embedded and Cyber Physical Systems. That’s why in the framework of the BMBF project “Software Plattform Embedded Systems 2020 XT“ (SPES XT), the Software Systems Engineering (SSE) research group develops and weigh up concepts, methods, and techniques to identify a continuous, model-driven software engineering approach dealing with these new challenges.
- About the eligibility:-
They will be deemed as eligible if
Applicants have recently completed or will complete their studies in Computer Science, Applied Computer Science, (embedded) Software Engineering, Systems Engineering or a related area within the next three months.
-They are creative, they enjoy working in a team, they are perceptive and they have good communication and analytical skills.
-It is appealing for them to collaborate with researchers and developers across different disciplines and in international settings.
-Experiences made in industry as well as in the areas of embedded systems are desired but not a prerequisite.
- About the awards:-
The herewith promoted position (salary classification TV-L 13) is at the start offered for two years with the option for extension for another three years. The position also provides the opportunity to pursue further academic qualification.
It covers the advertised position (salary classification TV-L 13).
- About the nationality:-
The International students can submit an application for this scholarship.
- About the applying procedure and Deadline:-
Applications have to be sent electronically. Your application documents should be attached to the e-mail as a single, continuous PDF-file. When including your academic records, please include an English translation of those records as well as an explanation of the grading scheme.
The application closing date is 14th February 2013.
For further information about the application and the scholarship please visit the link